Cadence LIVE Korea 2025
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작성일 25-09-19 09:59
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CoAsiaSEMI successfully completed its presentations at 'CadenceLIVE Korea 2025' on September 9th.
- Kibum Cheon, Group Leader: Chiplet Interconnect Design with Cadence Flow
- Taejong Baek, Group Leader: Design and Simulation Methodology for TAT Improvement in SiP/2.5D Packages
Through these presentations, we had the opportunity to share CoAsiaSEMI's innovative technology in chiplet and package design.
Thank you to everyone who attended.
- NextDa Nang Semiconductor Day 2025 25.09.11