CoAsia Semi Secures Government Project for Multi-Petaflops PIM Semiconductor for AI
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[Seoul = Newsis] Reporter Kim Kyung-taek = CoAsia announced on the 24th that its subsidiary, CoAsia Semi, a system semiconductor design specialist, has embarked on a government project to develop multi-petaflops-class PIM (Processing-in-Memory) server semiconductors jointly with AI semiconductor fabless company Rebellions.
According to the company, this project is part of the “Core Technology Development for PIM AI Semiconductors” program, led by the Electronics and Telecommunications Research Institute (ETRI). With a total budget of 8.6 billion KRW, the project will run for 3 years and 9 months, from April of this year through December 2028. Rebellions will be responsible for the design, while CoAsia Semi will handle advanced packaging analysis and manufacturing.
Through this initiative, CoAsia Semi plans to develop advanced package architectures optimized for next-generation AI servers. The advanced packaging will integrate high-performance NPUs (Neural Processing Units) for AI data centers with the latest 5th-generation high-bandwidth memory (HBM3E), and will incorporate future technologies such as:
2.5D packaging based on silicon interposers
2.3D technology using silicon bridges
2.1D packaging solutions based on redistribution layers (RDL)
Such heterogeneous integration packaging technologies are considered key to simultaneously meeting the high-bandwidth and low-power requirements of AI and HPC (High-Performance Computing) environments.
PIM is a next-generation semiconductor architecture that performs computations directly within memory, thereby reducing the data transfer bottleneck between CPU and memory. It can improve both processing speed and power efficiency. In particular, it is drawing attention as a technology capable of maximizing performance-per-watt in high-performance domains such as AI, HPC, big data analytics, and autonomous driving. The term “multi-petaflops-class” refers to compute performance capable of processing hundreds of trillions of operations per second (1 petaflop equals one quadrillion FLOPS).
Shin Dong-Soo, CEO of CoAsia Semi, stated, “This government project is not merely a typical state-funded initiative, but the first stage of extensive collaboration among the participating organizations. Through this project, we aim to advance our high-end packaging technologies and sign-off analysis capabilities for next-generation AI applications.”